XR2A-2811-N Omron Electronics Inc-EMC Div IC-Sockel

Hersteller: Omron Electronics Inc-EMC Div
Serie: XR2
Paket: Bulk
Produktstatus: Active
Typ: DIP, 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0碌in (0.25碌m)