48-6574-11 Aries Electronics IC-Sockel

Hersteller: Aries Electronics
Serie: 57
Paket: Bulk
Produktstatus: Active
Typ: DIP, ZIF (ZIP), 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0碌in (0.25碌m)