510-83-179-18-111101 Preci-Dip IC-Sockel

Hersteller: Preci-Dip
Serie: 510
Paket: Bulk
Produktstatus: Active
Typ: PGA
Anzahl der Positionen bzw. Pins (Raster): 179 (18 x 18)
Pitch - Paarung: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5碌in (0.75碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT)