28-6554-10 Aries Electronics IC-Sockel

Hersteller: Aries Electronics
Serie: 55
Paket: Bulk
Produktstatus: Active
Typ: DIP, ZIF (ZIP), 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0碌in (5.08碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0碌in (5.08碌m)