APA-640-T-B Samtec Inc. IC-Sockel

Hersteller: Samtec Inc.
Serie: APA
Paket: Bulk
Produktstatus: Active
Typ: -
Anzahl der Positionen bzw. Pins (Raster): 40 (2 x 20)
Pitch - Paarung: 0.100\ (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Phosphor Bronze Housing Material: Polybutylene Terephthalate (PBT)