714-43-248-31-018000 Mill-Max Manufacturing Corp. IC-Sockel

Hersteller: Mill-Max Manufacturing Corp.
Serie: 714
Paket: Bulk
Produktstatus: Active
Typ: DIP, 0.1\ (2.54mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0碌in (0.76碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Carrier Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold