110-93-950-41-001000 Mill-Max Manufacturing Corp. IC-Sockel

Hersteller: Mill-Max Manufacturing Corp.
Serie: 110
Paket: Tube
Produktstatus: Active
Typ: DIP, 0.9\ (22.86mm) Row Spacing Number of Positions or Pins (Grid): 50 (2 x 25) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0碌in (0.76碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0碌in (5.08碌m)